Conveyorised Chemical Clean Processor
Technical Specification
Conveyor width: 26” (660mm)
Panel thickness capability: 0.05 – 5.0 mm
Temperature: 0 – 50 ºC
Conveyor speed: 0.5 – 2.5 m/min
Triple cascade rinse
Drying Section: Incorporating PVA rollers and fluid head drier
Product Process Information
The chemical clean processor is used in the passivation removal and micro – etching of copper laminates prior to Hot-roll lamination of the UV photo-sensitive resist. The operation is an in-line horizontal conveyorised spray process, followed by rinsing and drying.
The process uses Mecbrite chemistry, leaving a clean etched surface topography for good photo-resist adhesion whilst giving a bright surface finish for subsequent AOI inspection.