Multiline Post-Etch Punch

Multiline Post-Etch Punch

Technical Specification

Panel Size:
Min: 10” x 12” (254 x 305mm)
Max: 24” x 28” (610 x 711mm)
Panel Thickness: 0.1 – 0.71 mm
Accuracy: +/- 0.001”/ 25.4um punch position
Repeatability: 0.0005”(12.5um)
The Post-Etch Punch Process ensures that panel registration for subsequent multilayer lamination is optimised. Any mis-alignment of the printing to tooling holes is eliminated as the registration holes are added post printing and etching. The 3 tooling holes are punched using printed targets which are used to align the panel from the captured images of the two cameras. Each panel is punched to the same set of targets, any dimensional movement of the material is accounted for, the cameras optimise the target position and separation prior to punching. Consequently every panel is punched with accurate repeatability and optimised for any material discrepancies ensuring excellent layer to layer registration without printing mis-alignment errors.
The Post-Etch punch produces a unique set of tooling holes which provide the registration points for the subsequent Piergiacomi inner-layer alignment and welding process.