Option’s capability of producing mass-laminated panels of extremely large layer counts (30+ layers) with intricate BGA circuitry has provided our customers with the technology to manufacture “Burn-in” boards for BGA and other component testing.
These boards are designed to electrically stress components at elevated temperatures for sufficient amount of time to cause failure.
This is essential in the multi-billion dollar semi-conductor industry as new components are developed.
Other such test boards that can be produced for similar test methods are loadboards and probe cards.
