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Metal-backed lamination

Option can offer Aluminium and Copper backed lamination with Thermal Management materials.  These components with their specific thermal properties are often used in the Aviation industry.

The heat generated by these devices is dissipated through the pcb material and out into Aluminium or Copper, thus having a permanent heat-sink attached to the pcb device.

Such high heat producing devices can therefore run safely without the risk of failure. Typical applications of such materials can be seen in Aircraft interior lighting, traffic signals, concealed lighting etc.

 

Other Applications

Dense fine-line multilayers

Dense fine-line multilayers

Option’s ability to manufacture dense fine-line circuits on thin copper weights,...

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Radio frequency materials

Radio frequency materials

Option manufacture high-frequency mass-laminated panels, bonding with materials ...

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High-Layer counts

High-Layer counts

Option’s capability of producing mass-laminated panels of extremely large layer ...

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Quick Quote

Option Technologies is a dynamic, technology driven manufacturer of masslam. Option enables PCB manufacturers all over the world to offer high-technology multilayers to their customers. For a quick, no obligation quotation please fill in your requirements below.

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