Option Technologies

X-Ray Check

Pluritec X-Check 300

Technical Specification

60kV X-ray Generator
Vision area: 19.5 x 14.6 mm
Max. Panel size: 48” x 24” (1220 x 610 mm)
Max. panel thickness: 8mm

The X- Check 300 is a static inspection bench, which uses X-ray technology for inspection and dimensional measurements of multi-layer printed circuit panels.  The equipment is able to accurately measure and document inner-layer features such as annular ring, registration, track-to-pad, hole pitches etc. The integrated x-ray capture gives a very clear quality image of the inner-layer features enabling complex analysis of the geometric and dimensional status of the panel.

The above analysis allows the drill operator to make accurate and informed decisions on offset values, scaling factors and other compensation requirements to ensure the multi-layer panel is drilled to the optimum highest quality.

Multi-layer panels can also be checked for inner-layer registration quality and determining the positional accuracy of the tooling holes prior to drilling.  Photographic and numerical data can be obtained which is extremely useful in feeding back into the manufacturing processes, aiding process control.