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Multiline Post-Etch Punch

Multiline Post-Etch Punch

Technical Specification

Panel Size:
Min: 10” x 12
(254 x 305mm)
Max: 24” x 28” (610 x 711mm)

Panel Thickness: 0.1 – 0.71 mm

Accuracy: +/- 0.001”/ 25.4um punch position

Repeatability: 0.0005”(12.5um)

Production capability: 180 panels/hour

The Post-Etch Punch Process ensures that panel registration for subsequent multilayer lamination is optimised.  Any mis-alignment of the printing to tooling holes is eliminated as the registration holes are added post printing and etching.  The 3 tooling holes are punched using printed targets which are used to align the panel from the captured images of the two cameras.  Each panel is punched to the same set of targets, any dimensional movement of the material is accounted for, the cameras optimise the target position and separation prior to punching.  Consequently every panel is punched with accurate repeatability and optimised for any material discrepancies ensuring excellent layer to layer registration without printing mis-alignment errors.

The Post-Etch punch produces a unique set of tooling holes which provide the registration points for the subsequent Piergiacomi inner-layer alignment and welding process.

 

Latest News

  • New Website Launched

    November 2nd 2009

    Welcome to Option’s new web-site, a comprehensive guide to all the services we currently offer. You will find sections accurately illustrating our capabilities, contact details and a new  “Quick- quote” feature for your convenience.

    We at Option hope you find the new site informative and interesting, we look forward to hearing from you.

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Option Technologies is a dynamic, technology driven manufacturer of masslam. Option enables PCB manufacturers all over the world to offer high-technology multilayers to their customers. For a quick, no obligation quotation please fill in your requirements below.

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