Circubond 2200 Bond enhancement process
Technical Specification
Cemco/FSL 3-stage conveyorised chemical processorConveyor width: 26” (660mm)
Panel thickness capability: 0.05 – 5.0 mm
Conveyor speed: 0 – 2.5 m/min
DI water 4-stage cascade rinsing
Product Process Information
The process incorporates an alkaline cleaning stage to remove resist residues and finger-prints, a pre-dip stage to prevent drag-in to the final stage, the circubond flood-chamber process.
The Circubond chemistry leaves the panel surface with an etched uniform brown passivated topography, promoting excellent bonding adhesion during the subsequent multilayer lamination process.