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Bonding Presses

Bonding Presses

Burkle 4-daylight Hot Transfer Vacuum Press

Mackey-Bowley 4-daylight Hot Transfer Vacuum Press

2 x Mackey Bowley Cold Presses

Pickard steel bonding plates

Technical Specification

Maximum panels size: 28” x  24” (711 x 610mm)
Maximum temperature: 250 ºC
Fully programmable Bonding Parameters (Burkle only) Multi-step, variable heat-rises & cooling etc.
Materials: FR4, High Tg, Polyimide, Low Dk (rogers etc), Flexible Coverlays, Flexi-rigids, Metal Backed (Aluminium & Copper), 5um to 140um inner/outer copper weights, Heat-Sinks etc.

The Hot Transfer Presses offer high production throughput by optimising the cycle –time.  The panels are bonded between high quality hardened steel plates with no registration pins being required, this allows the plates to be resin free ensuring defect free bonding (no indents etc.) and minimising down-time for cleaning.

Both presses have very good Vacuum facilities, allowing void-free  lamination for heavy copper weights and Flexible Coverlay bonding.
The high bonding temperature gives the possibility to laminate a wide range of materials.

Panels from every batch are measured for thickness using a digital checker.

 

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Option Technologies is a dynamic, technology driven manufacturer of masslam. Option enables PCB manufacturers all over the world to offer high-technology multilayers to their customers. For a quick, no obligation quotation please fill in your requirements below.

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